StyleLine Phono Interface

StyleLine Phono Interface

Get the most from your vinyl recordings with the MIT Family of Phono Interconnects—
3 Articulation Poles
The StyleLine Phono interface showcases MIT's breakthrough miniaturization technology with its MPC connector. MIT is able to construct Multipole networks on a wafer so small they fit inside an RCA connector! Measurements in our labs have shown consistently excellent results, allowing this new generation of surface-mounted parts to focus energy. The result is dimensional, natural and without blurring.

Features & Benefits:

  • Multipole Technology - wafered within our MPC connectors results in better bass, better midrange and smoother highs.
  • Quanti-Shield Technology - QST provides 98% RFI noise rejection and chassis-to-chassis ground circuits create a “black background” for audio

Sold as pairs.